Creotech Twardowski

Twardowski

The HyperSat satellite, in low lunar orbit, will map the Moon's surface to identify resources and support future landings.

Creotech Twardowski
The Twardowski mission is planned as a “Small Mission to the Moon.” In 2029, a satellite based on the HyperSat platform is scheduled to enter low lunar orbit and perform global imaging of the Moon’s surface in the visible and infrared (VIS–MIR) spectrum, with high spatial and spectral resolution. The data collected will enable detailed mapping of the Moon’s mineral resources and analysis of potential landing sites for international exploration programs, including the Artemis program.

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Mission description:

Twardowski

Client: European Space Agency (ESA)

Creotech's role: prime contractor and consortium leader

Mission Class: Small Mission to the Moon

Goal: A HyperSat satellite in low lunar orbit by 2029.

Twardowski is the first fully European lunar mission since SMART-1—that is, in over 20 years. Its mission is to gain a thorough understanding of the Moon’s resources, without which it would be difficult to envision permanent research bases on its surface. Oxygen, water, energy, and construction materials must be sourced locally, as transporting them from Earth is too costly.

In 2029, a satellite based on the HyperSat platform is scheduled to enter low lunar orbit and perform global imaging of the Moon’s surface in the visible and infrared (VIS–MIR) spectrum, with high spatial and spectral resolution. The collected data will be used to map mineral resources and evaluate potential landing sites for international exploration programs, including Artemis.

Creotech Instruments is the prime contractor for the mission and is responsible for the satellite platform, system architecture, and overall integration. We are carrying out the mission in collaboration with industrial and scientific partners from Poland and Europe. Phase A is a continuation of Phase 0, which we completed in 2025, and prepares the mission for the next stages of development.

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